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Events calendar 2019

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Wafer-Level Package handling and inspection/metrology platform

NOV
14
2019
14. NOV 2019

Presentation Hall B2 SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Smart Manufacturing II (hardware-centric)

12:15-12:40 h | Hall B2 Tech Arena 2, Booth B1.770

Subjects: SEMICON EUROPA

Speaker: Thomas Brillouet (RECIF Technologies)

Type: Presentation

Speech: English

The recent developments within the European Collaborative project TSV-Handy regarding the handling of different sizes and types of substrates, combined with integrated inspection and metrology, address several requirement aspects for Smart Manufacturing.

The two main challenges of 3D ICs manufacturing, TSV and Fan-Out Wafer Level Packaging techniques, is the multiplication of heterogeneous types of substrates which are presenting different mechanical behaviours and physical properties, and the lack of efficient and clean handling solution in the back-end market. A modular equipment, which is able to manipulate as many types of wafers as possible, without any hardware
reconfiguration and managed by a smart adaptive software, will help the end-users in gaining equipment flexibility, up-time and yield.
This presentation will give an outlook on how the modular approach responds to these challenges.

Thomas Brillouet

Thomas Brillouet

RECIF Technologies

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Informations

Thomas Brillouet
Thomas Brillouet
R&D Manager

Location

Eingang
Nord-West
ICM
Eingang
Nord
Eingang
West
Atrium
Eingang
Nord-Ost
Eingang
Ost
Conference
Center Nord
Freigelände
C1
C2
C3
C4
C5
C6
B0
B1
B2
B3
B4
B5
B6
A1
A2
A3
A4
A5
A6

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