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Presentation Hall B1 SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > MEMS along the Value Chain
15:05-15:25 h | Hall B1 Tech Arena 1, Booth B1.175
Subjects: SEMICON EUROPA
Thermal treatment in general, but also Rapid Thermal Processing (RTP) in particular, are well established processing technologies in semiconductor manufacturing  , . Even though MEMS fabrication is using the same fundamental technologies and methods, there are new challenges coming up with new device layouts and structures.Whereas most advanced processing technology in semiconductor device fabrication is done and available for 300 mm wafers, the highest performance requirements in MEMS fabrication are needed for 150 mm and 200 mm wafer size. As a consequence, there is a lack of equipment, addressing the technology needs of MEMS device manufacturing on relevant wafer size.Furthermore thermal mass distribution on semiconductor device wafers is rather uniform along the wafer radius, whereas MEMS devices often exhibit areal distributions of etched trenches and holes, having a distinct influence on thermal mass and its distribution over the wafer. Especially during the non-equilibrium phase of a thermal treatment, these areal variations have a strong influence on heating rates, soak times, and maximum temperature over the wafer.Last but not least, specific materials combinations, e.g. for contact formation, with specific properties (durability in harsh media, at elevated temperature,…) are requested in MEMS device technology, which have to be characterized and understood in terms of reaction kinetics e.g. with silicon, in terms of deposition behavior, and last but no least in terms of thermal treatment.The present publication discusses the various influences and challenges, and introduces potential technologies addressing those challenges. Using the example of pressure sensors, the efficiency of used methods is discussed.
HQ-Dielectrics GmbH, Technology
holds a diploma on physics and a PhD with specialization in solid state physics, both from the University of Ulm, Germany. He has 20+ years of experience in rapid thermal processing (RTP) technology and equipment development with respect to Si processing as well as compound semiconductor processing. He also has several years of experience in plasma oxidation resp. nitridation and related equipment specification and development. His experience is documented through multiple papers that were authored and co-authored by him as well as a book on “rapid thermal processing and beyond”, which was edited by him. He also holds patents in the field of RTP and plasma oxidation and has several patents pending.