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Events calendar 2019

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3D electronic packaging for IoT devices – from prototype to series production

NOV
14
2019
14. NOV 2019

Presentation Hall B1 SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > 3D Printing

15:10-15:30 h | Hall B1 Tech Arena 2, Booth B1.770

Subjects: SEMICON EUROPA

Speaker: Tobias Tiedje (TU Dresden IAVT, Faculty of Electrical and Computer Engineering, Electronics Packaging Laboratory)

Chairman: Stephan Raithel (, DAS Environmental Experts)

Type: Presentation

Speech: English

Rethinking electronic manufacturing - why do electronic components always have to be soldered onto a printed circuit board? Is it not possible to omit the printed circuit board at all and integrate the components directly into a single chip package instead? This was the question asked by Prof. Bock's team of four researchers at the Electronic packaging lab of the TU Dresden. The result is a manufacturing approach that saves around half of the process and design steps. Thereby, today’s and tomorrow’s challenges such as high-frequency transmission, cooling and miniaturization can be managed. The technology is called “connecting embedded components as a technological solution” – shortly KONEKT in German.The team around KONEKT raised the EXIST research transfer funding of the BMWi in the amount of 807,000€. This enables the production of adaptively manufactured 3D assemblies on large and competitive dimensions. The KONEKT-technology revolutionizes the electronic assembly by using 3D manufacturing and realizing high-frequency interconnects. It combines the possibility of producing individual packages of rapid prototyping and manufacturing at a large scale. Simplified processes facilitate fast and automated production of various assemblies. Therefore, energy, process and material costs will be reduced. Now, small and medium-sized companies have the opportunity to establish new business fields by ordering individual electronic packages without high set-up costs. During the EXIST-project the KONEKT team will establish a company, which will offer 'packaging-as-a-service'.Tobias Tiedje (KONEKT project manager): "With KONEKT a wide variety of products can be realized, starting from 3D-sensor systems as prototype up to RFIDs and high-frequency assemblies in series manufacturing for the Internet of Things (IoT). The clients will have much more possibilities in designing their product without limiting their creativity and innovation.”

Tobias Tiedje

TU Dresden IAVT, Faculty of Electrical and Computer Engineering, Electronics Packaging Laboratory

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Informations

Location

Eingang
Nord-West
ICM
Eingang
Nord
Eingang
West
Atrium
Eingang
Nord-Ost
Eingang
Ost
Conference
Center Nord
Freigelände
C1
C2
C3
C4
C5
C6
B0
B1
B2
B3
B4
B5
B6
A1
A2
A3
A4
A5
A6

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