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Presentation Hall ICM - Internationales Congress Center München SEMICON EUROPA > Advanced Packaging Conference > Session 5: Advanced Packaging
13:10-13:35 h | ICM - Internationales Congress Center München ICM Room 13b, 1st Floor
Subjects: SEMICON EUROPA
Chairman: Thomas Oppert (, PacTech - Packaging Technologies GmbH)
Minimal fab technology is a different method of semiconductor production. Integrated chip (IC) manufacturing facilities usually require billions of dollars in investment, which can be provided by only a few companies with the potential for high capital investments. Moreover, the conventional IC fabs require months to set up; whereas, minimal fabs can be up and running in days.The minimal fab does not require a clean room environment. Instead, the wafers are placed in a secured, clean-room-like container termed as the “shuttle” and loaded on the process stations. The transparent red material makes the wafer visible and blocks the UV radiation. It has been noted that the minimal fab uses maskless exposure technology, which means the traditional photomask preparation time (which typically takes months) can be avoided. Minimal fabs use direct draw and exposure, which makes it possible to avoid the photomasks. Furthermore, as the production is on wafer-to-wafer basis, the feedback is rapid.From an operational perspective, owing to the high capital cost and duration involved in set-up, conventional fabs require 24 hours of operations. Whereas, minimal fabs are able to operate effectively based on flexible production and working hours. Furthermore, minimal fabs require less time to convert research into production. Moreover, as minimal fabs do not require clean room environments, and as their systems are designed to be energy efficient and smaller, power consumption is estimated to be just one-tenth of that of conventional IC fabs. Therefore, Minimal fabs prove to be both operationally flexible and cost-efficient.Half-inch FOWLP Process Line utilizing Minimal Fab will be presented.
Dr. Kenji Miyake received his Ph.D. degree in the Graduate School of Science and Engineering from Yamaguchi University in Japan.He worked for Texas Instruments Japan for 28 years, since 1980.He conducted many international IT projects as Asia PacificAssembly Automation Manager in Texas Instruments Japan.He moved to PMT Corporation from Texas Instrument Japan in 2010. He has engaged in Minimal Foundry as Executive Officer, PMT Corporation.He has contributed the international semiconductor symposiums that are AEC/APC (Advanced Equipment Control/Advanced Process Control) and ISSM (International Symposium of Semiconductor Manufacturing) as Program Committee since 2005.