calender
Date & Time
Search
Datum
{{range.dates[index].day}}
{{range.dates[index].date}}
Time
Mornings Noon Afternoons Evenings
  • from
  • to
  • o'clock
Topic
Event location
Event
Properties
{{item.name}}
{{item.name}}
Exhibition venue

(please choose the desired areas)

Lecture language
Format

Events calendar 2019

Information about forums, live demonstrations, Accelerating Talents and panel discussion. The entire forum program is available in the event database.

Back to the EventList

Half-inch FOWLP Process Line utilizing Minimal FAB

NOV
13
2019
13. NOV 2019

Presentation Hall ICM - Internationales Congress Center München SEMICON EUROPA > Advanced Packaging Conference > Session 5: Advanced Packaging

13:10-13:35 h | ICM - Internationales Congress Center München ICM Room 13b, 1st Floor

Subjects: SEMICON EUROPA

Chairman: Thomas Oppert (, PacTech - Packaging Technologies GmbH)

Type: Presentation

Speech: English

Minimal fab technology is a different method of semiconductor production. Integrated chip (IC) manufacturing facilities usually require billions of dollars in investment, which can be provided by only a few companies with the potential for high capital investments. Moreover, the conventional IC fabs require months to set up; whereas, minimal fabs can be up and running in days.The minimal fab does not require a clean room environment. Instead, the wafers are placed in a secured, clean-room-like container termed as the “shuttle” and loaded on the process stations. The transparent red material makes the wafer visible and blocks the UV radiation. It has been noted that the minimal fab uses maskless exposure technology, which means the traditional photomask preparation time (which typically takes months) can be avoided. Minimal fabs use direct draw and exposure, which makes it possible to avoid the photomasks. Furthermore, as the production is on wafer-to-wafer basis, the feedback is rapid.From an operational perspective, owing to the high capital cost and duration involved in set-up, conventional fabs require 24 hours of operations. Whereas, minimal fabs are able to operate effectively based on flexible production and working hours. Furthermore, minimal fabs require less time to convert research into production. Moreover, as minimal fabs do not require clean room environments, and as their systems are designed to be energy efficient and smaller, power consumption is estimated to be just one-tenth of that of conventional IC fabs. Therefore, Minimal fabs prove to be both operationally flexible and cost-efficient.Half-inch FOWLP Process Line utilizing Minimal Fab will be presented.

Informations

Author,
PMT Corporation

PhD Kenji Miyake

Dr. Kenji Miyake received his Ph.D. degree in the Graduate School of Science and Engineering from Yamaguchi University in Japan.He worked for Texas Instruments Japan for 28 years, since 1980.He conducted many international IT projects as Asia PacificAssembly Automation Manager in Texas Instruments Japan.He moved to PMT Corporation from Texas Instrument Japan in 2010. He has engaged in Minimal Foundry as Executive Officer, PMT Corporation.He has contributed the international semiconductor symposiums that are AEC/APC (Advanced Equipment Control/Advanced Process Control) and ISSM (International Symposium of Semiconductor Manufacturing) as Program Committee since 2005.

PhD Kenji Miyake
Executive Officer

Location

Eingang
Nord-West
ICM
Eingang
Nord
Eingang
West
Atrium
Eingang
Nord-Ost
Eingang
Ost
Conference
Center Nord
Freigelände
C1
C2
C3
C4
C5
C6
B0
B1
B2
B3
B4
B5
B6
A1
A2
A3
A4
A5
A6

More Events