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Presentation Hall ICM - Internationales Congress Center München SEMICON EUROPA > Advanced Packaging Conference > Session 5: Advanced Packaging
12:45-13:10 h | ICM - Internationales Congress Center München ICM Room 13b, 1st Floor
Subjects: SEMICON EUROPA
Chairman: Thomas Oppert (, PacTech - Packaging Technologies GmbH)
MOEMS technology has undergone swift progress in recent decades. The ever prominent need for miniaturization and low cost has led many manufacturers to resort to MOEMS to address the optical requirements in their respective areas. One prominent use for MOEMS is in laser beam scanning systems and it is the laser sensor that most tech and car companies see as an essential component for self-driving cars. This paper addresses the challenges of packaging MOEMS actuated micro mirrors (developed by STM) to create a laser scanner sub assembly for distance metering, on a standard die bonding platform embarked upon during the L4M2 ENIAC funded project. The complexity of the packaging is attributed to several issues, from the handling of the 3D solid metal housing, requiring high precision and versatility when compared to standard flat substrates common in semiconductor assemblies, to various sub assembly procedures and handling of delicate MOEMS micro mirrors with keep-out zones and flex substrates. Such MOEMS devices also require a low defect yield in order to obtain a robust, reliable functional system. As such advanced metrology was integrated into a BESI die bonder in the form of a 3D image capturing system based on white light interferometry, capable of providing fast, real time, in-situ inspection of crucial parts, which are not possible to detect using conventional 2D cameras. Tilt measurement and bond line thickness measurement are all software features which were developed at BESI to analyse the 3D images and feedback the data for process auto correction by means of a 6-axis bondhead with possibilities of varying x, y, z, theta, Y-tilt and X-tilt positions. A new clean room kit system installed in the die bonder was also developed to address ISO class 4 and lower since MOEMS are highly susceptible to debris and foreign matter.
Jonathan Abdilla is Manager for Process Development at Besi Austria GmbH. He has a degree in Mechanical Engineering B.Eng (Hons), an MBA (Executive) from the University of Malta and a Diploma in Computing Information systems from the University of London. He has thirteen years of experience in the assembly & test of semiconductor devices. Prior to joining Besi Austria in 2014, Jonathan worked as an Assembly Line Process Engineer at STMicroelectronics Malta from 2006 until 2014. At Besi Austria, he is responsible for the Process Development group which focuses on research and development of advanced packaging and new pick and place technologies. Jonathan is also involved in coordinating Besi Austria’s participation in several national and EU funded projects.