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Mechanical Debonding for ultrathin chiplet manufacturing

NOV
13
2019
13. NOV 2019

Presentation Hall ICM - Internationales Congress Center München SEMICON EUROPA > Advanced Packaging Conference > Session 5: Advanced Packaging

11:30-11:55 h | ICM - Internationales Congress Center München ICM Room 13b, 1st Floor

Subjects: SEMICON EUROPA

Chairman: Thomas Oppert (, PacTech - Packaging Technologies GmbH)

Type: Presentation

Speech: English

In-package integration of heterogeneous silicon to form chiplets is gaining momentum. To use vertical integration wafer thinning is of essence for heterogeneous integration of chiplets. To support the valuable wafer throughout the whole process with high yield, the employed temporary bond to a carrier wafer additionally to the separation must be well controlled and understood. Mechanical Debonding offers the advantage of using a Si support carrier in combination with room temperature debonding. For the intermediate adhesive dual layer systems with an adhesive and a release layer are studied, where the adhesive can be either a thermoplastic or a curable material. This leads not only to divergent process steps at bonding but also to a different behavior at elevated temperatures. Different materials and material classes are compared, therefor metrology for relevant parameters like total thickness variation (TTV) is employed after every critical process step to control the whole process.In the presentation we will show different temporary bonding integration flows for chiplets, such as needed for heterogeneous integration in fan out devices, as well as high performance interposer packages. In more detail, the thickness evolution during processing and thinning will be reviewed and presented by high resolution thickness maps.

Informations

Author,
EVG

Elisabeth Brandl

Elisabeth Brandl is business development manager at EV Group for temporary and adhesive bonding. She holds a Master degree (DI) in technical physics from the Johannes Kepler University Linz specialized on nanoscience and - technology. During her master thesis at the institute of semiconductor and solid state physics she gained experience for semiconductor processing and nanofabrication.

Elisabeth Brandl
Business Development Manager
EVG

Location

Eingang
Nord-West
ICM
Eingang
Nord
Eingang
West
Atrium
Eingang
Nord-Ost
Eingang
Ost
Conference
Center Nord
Freigelände
C1
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C3
C4
C5
C6
B0
B1
B2
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B5
B6
A1
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A6

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