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Events calendar 2019

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Advanced Assembly Materials for Enabling Heterogeneous Integration and System-in-Package (SiP) Applications

NOV
13
2019
13. NOV 2019

Keynote Hall ICM - Internationales Congress Center München SEMICON EUROPA > Advanced Packaging Conference > Session 4: New Materials and Processing in Packaging

09:10-09:40 h | ICM - Internationales Congress Center München ICM Room 13b, 1st Floor

Subjects: SEMICON EUROPA

Speaker: Ramachandran Trichur (Henkel Corporation)

Chairman: Jens Mueller (, Test)

Type: Keynote

Speech: English

For a majority of the wafer fabs and applications, as the front-end lithography nodes move towards 7nm and lower, the upfront cost of the photolithography equipment and the total cost of ownership of the process outweighs the benefit gained from this technology. Only less than a handful of manufacturers can continue to invest in the bleeding edge front end lithography technology. Due to technological complexity of such processes, the pace of node shrinkage has slowed down sharply compared to Moore’s law. In the last few years, backend packaging technology has moved from being considered an afterthought for assembling the silicon device to the forefront for improving the performance of the packaged device. Mega trends like big data, artificial intelligence, 5G connectivity and autonomous driving applications are the drivers for advanced packaging of semiconductor devices. Advanced packaging enables these next generation devices to have higher bandwidth, faster processing speeds, reduction in form factor, reduction in total cost of packaging, and other benefits depending on the packaging technology used. Advanced packaging architectures present a myriad of assembly challenges that require innovation in packaging materials and processes. Requirements for packaging density, performance and cost vary between end applications such as mobile, high performance computing and automotive components. Various challenges are addressed by advanced packaging materials in all these applications.In this paper, we will present the pain points of advanced packaging methods and recent advancements in assembly material technologies for encapsulation using liquid compression molding (LCM), underfills (CUF, NCP NCF), warpage control, electro-magnetic interference (EMI) shielding materials that enable these advanced packages. Advanced assembly material development is critical to meet the stringent performance and packaging requirements for high performance micro-electronic devices.

Ramachandran Trichur

Ram Trichur is the Global Head for Advanced Semiconductor Packaging Market Segment in Henkel’s Adhesives Technology division. Ram has 19 years of experience in the microelectronics industry covering both the front-end wafer processing and backend assembly processes, 3 patents with over 40 publications and technical articles in leading industry conferences and magazines. Ram received his master’s degree in Electrical Engineering from University of Cincinnati and completed his executive education in business management from Stanford University’s Graduate School of Business.

Ramachandran Trichur

Henkel Corporation

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Informations

Ramachandran Trichur

Ram Trichur is the Global Head for Advanced Semiconductor Packaging Market Segment in Henkel’s Adhesives Technology division. Ram has 19 years of experience in the microelectronics industry covering both the front-end wafer processing and backend assembly processes, 3 patents with over 40 publications and technical articles in leading industry conferences and magazines. Ram received his master’s degree in Electrical Engineering from University of Cincinnati and completed his executive education in business management from Stanford University’s Graduate School of Business.

Ramachandran Trichur
Director, Global Head of Advanced Packaging Market Segment

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