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Lecture Hall A1 productronica Forum
11:30-12:00 h | Hall A1 productronica Forum, A1, booth 220
Subjects: Soldering and joining technology for PCBsSpeaker: Steven Teliszewski
In electronics manufacturing, more and more defects are being related to the high soldering temperatures of lead-free soldering alloys. Temperature sensitive components and PCB materials can be damaged or pre-damaged when exposed to too high soldering temperatures. When the failure can be detected in production, it can be repaired. However, a lot of affected components will pass ICT and CAT testing, and this can lead to an early failure of the electronic unit in the field. This involves high repair costs but can also lead to potentially dangerous situations. A simple solution would be to reduce the soldering temperature. This can be achieved by using a low melting point soldering alloy. In the meantime, a lot of manufacturers have successfully implemented these low melting point alloys and INEMI has predicted that by 2027 at least 20% of the industry will have changed over to them. Practical experiences show that these alloys can also increase productivity and reduce cost. Furthermore some enhanced low melting point alloys have proven to provide overall acceptable to good mechanical reliability. This lecture discusses the main driving reasons for low melting point alloys and the considerations to be made before implementing them. It also gives an insight in the practical implementation of an enhanced low melting point alloy in the different soldering processes in the production environment. It discusses the practical experiences, the cost benefits and the mechanical reliability of this alloy.