Information about forums, live demonstrations, Accelerating Talents and panel discussion. The entire forum program is available in the event database.
Lecture Hall B2 Innovation Forum
16:10-16:40 h | Hall B2 Innovation Forum, B2, booth 441
Subjects: Test and measurement, quality assuranceSpeaker: Johannes Eschenauer (Hitachi High-Tech Analytical Science GmbH)
XRF analysis is a widely used technique to measure plating thickness. Its main advantage resides in allowing simultaneous non-destructive analysis of multilayered plating samples.
The miniaturization and increasing complexity of electronic devices proliferated by advancements in smartphone functionality continues with the rise of microelectromechanical systems (MEMS). Consequently, the electronic components and features for these devices are becoming as minuscule as ever. In order to maintain the necessary quality of these components, the measuring and control of the plating thickness is crucial. For this application, an XRF plating thickness analyzer capable of high accuracy measurement in small areas is essential.
Utilizing the latest X-ray focusing polycapillary technology with a high-sensitivity detector, the XRF systems offered by Hitachi High-Tech deliver high-precision measurements of nanometer-scale plating. The beam diameter of less than 20 µm (FWHM) not only allows plating thickness measurements but also composition analysis, useful for solder bumps. This allows for an outstanding measurement repeatability, achieving precision of 1% RSD for gold plated at 100Å. Furthermore, the levels of irradiated energy are lower than those utilized in wavelength dispersive (WDXRF) techniques, thus considerably reducing the potential damage to the sample.
Whether measuring microscopic plated areas or analyzing the composition of solder bumps, the Hitachi High-Tech energy dispersive X-ray fluorescence coatings analysis systems are straightforward, effective solutions for quality assurance and quality control.