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Vortrag Halle B1 SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > MEMS along the Value Chain
16:05-16:25 Uhr | Halle B1 Tech Arena 1, Booth B1.175
Themen: SEMICON EUROPASprecher: Bozena Matuskova (EVG)
Chairman: Dr. Thomas Uhrmann (, EV Group (EVG))
Highly functional optical materials are getting more and more attention in the photonics’ applications, particularly shielding materials and IR-related materials for optical MEMS applications. As the complexity of the photonic devices is increasing together with the optical performance, advancements in the materials and according lithographic patterning are demanded. These innovative materials show promising parameters taking the advantage of micro-dispersion technologies of ultra-fine pigments and photopolymer technologies. In this paper, the advanced resist processing and parameters of a new black material designed for miniaturized photonic devices from FFEM and optimized lithographic patterning is discussed. Resist processing methods including spin and spray coating are combined depending on required optical performance.. The UV light penetration of the coated substrate with functional black resist layer in the NUV spectrum range is limited. The absorption level of the material is already significant in the upper part of the layer closer to resist surface preventing the light from transmission to the underlying resist during the exposure. This affects the final resist polymerisation. As a consequence, the resist development process becomes challenging with the risk of introducing patterning, delamination defects or not fully resolved structures. Therefore an enhanced adjustment and further precise control of the development process is necessary in order to secure overall performance capabilities. The joint collaboration of FFEM black material division and EV Group process development enabled high precision black resist processing and optimized high resolution lithographic patterning of advanced photonic devices. The goal of this paper is to present the obtained results and augmented lithographic processes established for current and future optical MEMS applications