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Wafer-Level Package handling and inspection/metrology platform

NOV
14
2019
14. NOV 2019

Presentation Halle B2 SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Smart Manufacturing II (hardware-centric)

12:15-12:40 Uhr | Halle B2 Tech Arena 2, Booth B1.770

Themen: SEMICON EUROPA

Sprecher: Thomas Brillouet (RECIF Technologies)

Format: Presentation

Sprache: Englisch

The recent developments within the European Collaborative project TSV-Handy regarding the handling of different sizes and types of substrates, combined with integrated inspection and metrology, address several requirement aspects for Smart Manufacturing.

The two main challenges of 3D ICs manufacturing, TSV and Fan-Out Wafer Level Packaging techniques, is the multiplication of heterogeneous types of substrates which are presenting different mechanical behaviours and physical properties, and the lack of efficient and clean handling solution in the back-end market. A modular equipment, which is able to manipulate as many types of wafers as possible, without any hardware
reconfiguration and managed by a smart adaptive software, will help the end-users in gaining equipment flexibility, up-time and yield.
This presentation will give an outlook on how the modular approach responds to these challenges.

Sprecher,
RECIF Technologies

Thomas Brillouet

Thomas Brillouet

RECIF Technologies

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Sprecher,
RECIF Technologies

Thomas Brillouet
Thomas Brillouet
R&D Manager

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