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Trends in Automotive: Fab Inspection and Metrology Changing Role in “Zero Defect”

NOV
13
2019
13. NOV 2019

Presentation Halle ICM - Internationales Congress Center München SEMICON EUROPA > SMART Transportation Forum > Session 2: Comprehensive Overview on Disruptive Technology Requirements for Smart Driving

12:15-12:35 Uhr | ICM - Internationales Congress Center München ICM Room 14c, 1st Floor

Themen: SEMICON EUROPA

Chairman: Andreas Aal (, Volkswagen AG)

Format: Presentation

Sprache: Englisch

Semiconductor fabs have historically used inspection and metrology equipment for yield learning – to monitor individual process tools for excursions and to assure that their manufacturing processes stay in control to maximize productivity. The increasing semiconductor content in automobiles, driven by growth in ADAS, electrification and autonomy, has put a growing focus on the quality and reliability of these devices and their implications for consumer safety and satisfaction.This push for better reliability is embodied in the industry’s Zero Defect initiative, as car manufacturers drive semiconductor DPPM requirements for their chip suppliers below 1PPM. More than half of the semiconductor failures that occur on the automotive assembly line today (so-called 0km failures) have their origin in semiconductor fab defectivity. To successfully meet their customers’ reliability goals, fabs across the full range of design rules and device types are looking at their inspection and metrology data in a fresh light. Not only are they using their process control tools to do a better job of reducing overall sources of defectivity, they are also looking to the data to help disposition individual die, removing high-risk defective die from the supply chain.In this keynote, KLA will update some of these industry trends and some of the exciting steps forward in quality and reliability made possible by these novel methods.

Informationen

Author,
KLA Corporation

Oreste Donzella

Oreste Donzella serves as Sr. Vice President and Chief Marketing Officer at KLA Corporation.In his current position, Oreste is responsible for corporate communications, market analytics, customer technology roadmap and semiconductor ecosystem collaborations. In addition to his CMO responsibilities, he is also in charge of automotive solutions and collaborations, the ICOS division and back-end packaging initiatives.Prior to his current role, Oreste led the world-wide field applications engineering team, and was responsible for Customer Engagement projects and product portfolio optimization for wafer inspection platforms at KLA.Previously, Oreste was Vice President and General Manager of the Surfscan and SWIFT divisions at KLA-Tencor. In these positions, Oreste was responsible for the unpatterned wafer inspection, wafer geometry, and macro inspection business, overseeing new products development, sales, and marketing activities, customer support, and ultimately, division financial performance (P&L).Oreste brings 25+ years of experience in the semiconductor industry. Prior to joining KLA in 1999, he spent more than six years at Texas Instruments and Micron Technology, holding engineering and management positions in the process integration and yield enhancement departments.

Oreste Donzella
Senior Vice President & Chief Marketing Officer

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