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Ultra-Low Stress Silicone Die-Attach Film For Stress Sensitive, SiP and Stacked Dies Assembly

NOV
12
2019
12. NOV 2019

Presentation Halle ICM - Internationales Congress Center München SEMICON EUROPA > Strategic Materials Conference > Session 1 - Materials and Processes for Wafer-Level Packaging

14:30-14:55 Uhr | ICM - Internationales Congress Center München ICM Room 13a, 1st Floor

Themen: SEMICON EUROPA

Format: Presentation

Sprache: Englisch

Silicones are inorganic based materials with remarkable properties such as broad temperature range stability, low modulus and possibility to be loaded with multiple fillers to tune the thermal, optical and mechanical properties. The microelectronics technology trends towards smaller form factors, increased integration of multiple devices within the same package (SiP) or stacking of dies architecture lead DOW to develop a unique die-attach film technology to be used as laminated film at wafer-level or large component level. The die-attach film consists in a pre-cured film laminated between two liners and designed to be used in mass production environment. The technology developed can be supplied with a thickness between 25µm and 300µm depending on the device requirements. Independent of this thickness, the film has a stable and low storage modulus below 1MPa over a temperature range from -40°C to 220°C. The coefficient of thermal expansion (CTE) is also stable across the same temperature range, at 290ppm/K. This combination of extremely low stress and reasonable CTE ensures that the total stress during thermo-mechanical fatigue of the device will remain remarkably low compared to organic materials such as epoxies or acrylics that have a modulus significantly higher (~1000 times higher than silicones). In addition, using a pre-cured film will ensure that the bond line thickness (BLT) is precisely controlled and that no adhesive fillet will rise along sidewalls of the chip during the assembly process, making it possible to bond thinned dies without contamination risk. This unique solution completes an already existing broad portfolio of liquid-based silicone solutions used as adhesives for die-attach, lid-seal and grounding applications, together with thermally conductive silicone materials used as thermal interface material between the chip and package to improve the heat spreading.

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Dr. Thomas Seldrum

Dr. Thomas Seldrum holds a PhD in Solid State Physics and is working as a Technical Development Scientist within the DOW Chemical Company. In his assignment, Dr. Seldrum is responsible for the application development of silicone-based solutions used in Automotive and Microelectronics applications. He started his career within DOW with the development of wafer-level silicone solutions for wafer passivation and manufacturing of transparent silicone membrane for optical applications. He is mostly today focusing on the application development of silicone die-attach film technologies, electrically conductive adhesives and thermally conductive materials used in the assembly of sensors and actuators.

Dr. Thomas Seldrum
TS&D Scientist

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