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Presentation Halle ICM - Internationales Congress Center München SEMICON EUROPA > Strategic Materials Conference > Session 1 - Materials and Processes for Wafer-Level Packaging
14:05-14:30 Uhr | ICM - Internationales Congress Center München ICM Room 13a, 1st Floor
Themen: SEMICON EUROPA
Processes using temporary bonding materials (TBMs) are now frequently integrated into advanced packaging processes that require thin wafer handling. Initially, materials and processes were developed for silicon to enable through-silicon vias (TSVs) as interconnect for 3D stacking. However, the need to handle highly warped and stressed substrates such as reconstructed epoxy mold compound (EMC) wafers or thin alternative metal substrates has further broadened the utility of TBMs.This presentation will highlight how materials developed for temporary thin wafer handling are evolving and being adapted to diverse applications. The first example will review processes in chip-first fan-out wafer-level packaging (FO-WLP) where TBMs are used for temporary die placement. In general, RDL processing and the density of I/O connections after mold is limited due to issues with die shift during mold processing. However, by selecting a TBM with the right properties and coupling it with the right EMC, one can achieve
Brewer Science, Inc
Alice Guerrero is a senior applications engineer with Brewer Science, Inc. She is currently a resident scientist for Brewer Science at imec in Leuven, Belgium in partnership with the 3D System Integration Program.She received her undergraduate degree in chemistry from Union College, in Lincoln, NE and completed her PhD in Analytical Chemistry at the University of Illinois in Champaign-Urbana. Alice has worked for Brewer Science for 21 years in both the Semiconductor Materials and Advanced Packaging business divisions in technical and project management roles. Her current focus is developing processes for emerging temporary bond and debond applications.