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Presentation Halle ICM - Internationales Congress Center München SEMICON EUROPA > Strategic Materials Conference > Session 1 - Materials and Processes for Wafer-Level Packaging
13:10-13:40 Uhr | ICM - Internationales Congress Center München ICM Room 13a, 1st Floor
Themen: SEMICON EUROPA
Driven by movements towards further miniaturization and higher functionalities, megatrend applications like artificial intelligence (AI), 5G, and augmented reality (AR)/virtual reality (VR) are creating huge business opportunities and contributing to the growth of AP applications. Indeed, these megatrend applications are fueling the next generation of AP platforms (high-density FOWLP, 3D stacked TSV memory, WLCSP, and flip-chip), which have reached a new level of complexity and now demand higher integration-level requirements. These lofty standards will strongly influence the increasing demand for advanced materials with new technical specifications, in order to achieve better performance.Polymeric materials are primarily used to protect printed wiring boards (PWB) from moisture, handling, and environmental influences. However, over the last few years polymeric materials have attracted significant interest in the microelectronics field, and have already found integration in major process steps: RDL, bump/UBM, through-silicon vias (TSV), and assembly levels, as well as at the bonding interface.This presentation will provide a comprehensive analysis of the different existing polymeric materials used for Advanced Packaging as well as their status. In addition, key technical trends, requirements and challenges regarding the polymeric materials applied at each advanced packaging process step will be addressed. A technology roadmap showing the future steps for these polymeric materials solutions as well as market forecast, competitive landscape of the major material suppliers will be covered.
Amandine Pizzagalli is a Technology & Market Analyst, Equipment & Materials - Semiconductor Manufacturing, at Yole Développement (Yole). Amandine is part of the development of the Semiconductor & Software division of Yole with the production of reports and custom consulting projects. She is in charge of comprehensive analyses focused on semiconductor equipment, materials and manufacturing processes.Previously, Amandine worked as Process engineer on CVD and ALD processes for semiconductor applications at Air Liquide. Amandine was based in Japan during one year to manage these projects.Amandine graduated from the engineering school, CPE Lyon (France), with a technical expertise in Semiconductor & Nano-Electronics and holds an electronics engineering degree followed by a master’s in semiconductor manufacturing technology from KTH Royal institute of technology (Sweden).She has spoken in numerous international conferences and has authored or co-authored more than 10 papers.