Kalender
Datum & Uhrzeit
Suchen
Datum
{{range.dates[index].day}}
{{range.dates[index].date}}
Uhrzeit
Vormittags Mittags Nachmittags Abends
  • von
  • bis
  • Uhr
Thema
Veranstaltungsort
Veranstaltung
Eigenschaften
{{item.name}}
{{item.name}}
Messegelände

(bitte wählen Sie die gewünschten Bereiche)

Vortragssprache
Format

Veranstaltungskalender

Informationen zu Foren, Live-Demonstrationen, Accelerating Talents und Diskussionsrunden. In der Termindatenbank finden Sie auch das gesamte Forenprogramm.

Zurück zur Terminauswahl

Polymeric materials for Advanced packaging

NOV
12
2019
12. NOV 2019

Presentation Halle ICM - Internationales Congress Center München SEMICON EUROPA > Strategic Materials Conference > Session 1 - Materials and Processes for Wafer-Level Packaging

13:10-13:40 Uhr | ICM - Internationales Congress Center München ICM Room 13a, 1st Floor

Themen: SEMICON EUROPA

Format: Presentation

Sprache: Englisch

Driven by movements towards further miniaturization and higher functionalities, megatrend applications like artificial intelligence (AI), 5G, and augmented reality (AR)/virtual reality (VR) are creating huge business opportunities and contributing to the growth of AP applications. Indeed, these megatrend applications are fueling the next generation of AP platforms (high-density FOWLP, 3D stacked TSV memory, WLCSP, and flip-chip), which have reached a new level of complexity and now demand higher integration-level requirements. These lofty standards will strongly influence the increasing demand for advanced materials with new technical specifications, in order to achieve better performance.Polymeric materials are primarily used to protect printed wiring boards (PWB) from moisture, handling, and environmental influences. However, over the last few years polymeric materials have attracted significant interest in the microelectronics field, and have already found integration in major process steps: RDL, bump/UBM, through-silicon vias (TSV), and assembly levels, as well as at the bonding interface.This presentation will provide a comprehensive analysis of the different existing polymeric materials used for Advanced Packaging as well as their status. In addition, key technical trends, requirements and challenges regarding the polymeric materials applied at each advanced packaging process step will be addressed. A technology roadmap showing the future steps for these polymeric materials solutions as well as market forecast, competitive landscape of the major material suppliers will be covered.

Informationen

Amandine Pizzagalli

Amandine Pizzagalli is a Technology & Market Analyst, Equipment & Materials - Semiconductor Manufacturing, at Yole Développement (Yole). Amandine is part of the development of the Semiconductor & Software division of Yole with the production of reports and custom consulting projects. She is in charge of comprehensive analyses focused on semiconductor equipment, materials and manufacturing processes.Previously, Amandine worked as Process engineer on CVD and ALD processes for semiconductor applications at Air Liquide. Amandine was based in Japan during one year to manage these projects.Amandine graduated from the engineering school, CPE Lyon (France), with a technical expertise in Semiconductor & Nano-Electronics and holds an electronics engineering degree followed by a master’s in semiconductor manufacturing technology from KTH Royal institute of technology (Sweden).She has spoken in numerous international conferences and has authored or co-authored more than 10 papers.

Amandine Pizzagalli
Technology & Market Analyst,Equipment & Materials - Semiconductor Manufacturing

Lageplan

Eingang
Nord-West
ICM
Eingang
Nord
Eingang
West
Atrium
Eingang
Nord-Ost
Eingang
Ost
Conference
Center Nord
Freigelände
C1
C2
C3
C4
C5
C6
B0
B1
B2
B3
B4
B5
B6
A1
A2
A3
A4
A5
A6

Weitere Veranstaltungen