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High performance photonic technologies for communication and sensing applications

NOV
14
2019
14. NOV 2019

Presentation Halle B1 SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Smart Photonics

11:00-11:20 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Themen: SEMICON EUROPA

Format: Presentation

Sprache: Englisch

Photonic integrated circuits (PICs) have been subject of intense research and gained increased attention during last decades. Different wafer level technologies based on silicon-on-insulator offer platforms for novel advanced application areas as high data rate communication and photonicbio-sensing. Silicon photonic devices have the advantage that they are highly capable of being integrated, which allows an efficient combination of electronic and photonic devices with digital and analogue devices in electronic-photonic-integrated circuit (EPIC) technologies. However, silicon has drawbacks in terms of material properties and therefore in performance. In this talk, we present current progress in joint module developments of SiGe heterojunction bipolar transistors and related BiCMOS technologies in conjunction with monolithic integrated silicon photonic components. Moreover, recent results of novel integration concepts will be presented showing the potential to overcome material limitation of silicon in terms of electro-optic effects. This is followed by a brief overview of silicon-based photonic sensors for biochemical sensing. We discuss integration concepts, which are compatible to standard CMOS technologies showing the potential for future high performance silicon photonic technologies.

Informationen

Author,
IHP, Technology

Prof. Dr. Andreas Mai

received his diploma degree in physics from the Technical University of Brandenburg jointly with AMD Saxony in 2006 and his PhD in 2010. He joined the “Process Integration” group of IHP Technology Department in 2006 and he focused on the development of a 130nm SiGe-BiCMOS technology for mm-wave applications and the integration of RF-LDMOS transistors. He became group leader of the “Process Integration” team at IHP in 2012 and Head of the “Technology-Department” in 2015. Since 2018 he hold a professorship at the technical University of Applied Science Wildau for “Micro- and Nanoelectronics”. He is an IEEE member, Chair of the “ECS-SiGe Processing” symposia and head of the Joint-Lab between University of Applied Sciences Wildau and IHP.

Prof. Dr. Andreas Mai
Department Head

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Nord
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West
Atrium
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Ost
Conference
Center Nord
Freigelände
C1
C2
C3
C4
C5
C6
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B1
B2
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