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Presentation Halle B1 SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Smart Photonics
10:40-11:00 Uhr | Halle B1 Tech Arena 1, Booth B1.175
Themen: SEMICON EUROPA
Leveraging Silicon photonics and 3D technologies developed at CEA-Leti over the past 15 years, SCINTIL Photonics was created to industrialize and commercialize the next generation of high-speed optical interconnects.With unique fully integrated photonic solutions, SCINTIL Photonics will boost big ASICs with multi-terabit per second (Tbps) I/O bandwidth for Cloud demanding applications like Machine learning and Artificial Intelligence.While 'Silicon Photonics technology' is now a best seller for 100 Gigabit per second (Gbps) optical interconnects in Data centers, the lack of integrated lasers on Silicon prevents the solutions from scaling to higher bit rates with Wavelength Division Multiplexing (WDM). Indeed, Silicon Photonics technology still requires Indium Phosphide (InP) based laser sources to be individually and precisely packaged to the silicon photonic circuit, making it difficult to use several lasers.In addition, next generation interconnects need to get closer to the host ASICs for speed purposes and therefore need to be co packaged with them. Solutions coming into the form of fully integrated circuits that can be packaged with advanced 3D integration technologies are highly awaited.SCINTIL combines the best of Si and InP materials using wafer-scale bonding of InP on Si and Relying on existing Commercial Silicon foundry processes.SCINTIL technology will be presented, with mass production capability of photonic fully Integrated Circuits for 800 Gbit/sec and above transceivers.through WDM 400G, 800G, 1600G - and complex modulation.Scintil Photonics can also make technology and supply chain available for realization of lidar, cryptography devices and chip to chip optical interconnect which is vital for Hpc and AI
Pascal LANGLOIS cofounded Scintil Photonics on November 2018 with Doctor Sylvie Menezo CEO .He is serving as Chairman of the board and deputy CEO. Most recently, Langlois was President and CEO of Tronics Microsystems, a Mems company he successfully introduce on Euronext Stock market in February 2015 and which was acquired by TDK Group end of 2016. Prior to that he was Chief Sales and Marketing Officer at ST-Ericsson and from 2006, Founder of NXP and part of the executive management team responsible for global commercial operations. He was previously with Philips Semiconductors BV, where he served in various capacities, including Senior Vice President of Sales and Marketing for multimarket products and Vice President/General Manager of the automotive global market segment. He also worked with National Semiconductors, and VLSI Technology, where he held various executive management positions. Pascal graduated with a Bachelor in technology from the University of Paris, and attended strategy and organization executive program from Stanford University.