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Presentation Halle B1 SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > MEMS along the Value Chain
15:45-16:05 Uhr | Halle B1 Tech Arena 1, Booth B1.175
Themen: SEMICON EUROPA
MEMS market trends are demanding dies that are thinner, smaller, and stronger. Conventional line-by-line dicing methods, such as mechanical sawing (“blade dicing”) or laser dicing, are not suitable for fragile MEMS devices, both in terms of economics and reliability.Plasma Dicing is an alternative method to overcome the many challenges of MEMS wafer singulation that are encountered during conventional line-by-line dicing methods.Plasma Dicing for MEMS wafers utilizes plasma trench etch (“dry etch”) technology and is damage-free (no chipping, no cracking), offers smoother sidewalls, is particle-free and enables high-throughput. In addition, flexible chip shape design—including round and offset chips is possible.Plasma Dicing is performed by opening dicing streets on a mask on the wafer surface, and etching where the wafer surface has been exposed. Several masking techniques suitable for MEMS wafers that have been developed by Panasonic can be offered. The throughput of Plasma Dicing depends principally on the thickness of the wafer, and is independent from wafer size, chip size and chip shape. By utilizing Plasma Dicing for MEMS, higher throughput and higher quality than conventional dicing can be achieved. As market trends demand smaller-and-smaller chip sizes—as is typical for MEMS devices—Plasma Dicing offers many benefits when compared to those of conventional line-by-line dicing methods; especially in terms of cost savings and quality increases.Patented techniques, processes and new equipment developed by Panasonic allow for low cost-of-ownership Plasma Dicing of MEMS wafers, and will be discussed in this paper.
James completed a degree in Mechanical Engineering from the University of Adelaide in Australia in 2006. Since then he has held various roles in Field-test Engineering, Technical Support Engineering, Project Management & Sales for different companies; mainly in the oil and gas industry. Since 2016 he has been the Business Development Manager for microelectronics at Panasonic Factory Solutions Europe. James' main targets are to establish new business in the European Back-end and Front-end Industry; especially in the field of Plasma Dicing and Dry Etching Equipment, but also Plasma Cleaning, Die-attach and Flip-chip technologies.