Kalender
Datum & Uhrzeit
Suchen
Datum
{{range.dates[index].day}}
{{range.dates[index].date}}
Uhrzeit
Vormittags Mittags Nachmittags Abends
  • von
  • bis
  • Uhr
Thema
Veranstaltungsort
Veranstaltung
Eigenschaften
{{item.name}}
{{item.name}}
Messegelände

(bitte wählen Sie die gewünschten Bereiche)

Vortragssprache
Format

Veranstaltungskalender

Informationen zu Foren, Live-Demonstrationen, Accelerating Talents und Diskussionsrunden. In der Termindatenbank finden Sie auch das gesamte Forenprogramm.

Zurück zur Terminauswahl

Pushing the Limits: Recent Advancements in the Optical Characterization of MEMS Devices

NOV
13
2019
13. NOV 2019

Presentation Halle B1 SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > MEMS along the Value Chain

14:45-15:05 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Themen: SEMICON EUROPA

Format: Presentation

Sprache: Englisch

Instruments for analysis and 3D visualization of dynamic response and static shape are key for developing MEMS. They are indispensable for validating FE calculations, determining cross-talk effects and measuring surface topography and deformation.State of the art metrology solutions as the new Polytec MSA-600 Micro System Analyzer combine several measurement techniques into a convenient “All-in-One” solution for 3D motion analysis and surface metrology. This instrument delivers increased measurement flexibility, bandwidth and precision, adapting to the needs of today’s and tomorrow’s microstructures.When incorporated in the MEMS design and test cycle, the Micro System Analyzer provides instant frequency response plots of periodic motions and precise time response plots of transient motions useful for increasing device performance. This reduces development and manufacturing costs by shortening design cycles, simplifying trouble shooting and improving yield.

Informationen

Author,
Polytec GmbH

Markus Heilig

Since 2017, Product Manager at Polytec GmbH, responsible for Laser Doppler Vibrometry and Surface Topography in microstructure applications.2013-2017, Product Manager at EV Group E. Thallner GmbH, responsible for inspections systems for overlay and topography in the semiconductor production.2008-2013, research assistant at the Institute for Microstructure Technology, Karlsruhe Institute of Technology (KIT), with focus on micro- and nano replication, equipment design and measurement technology.2008 Interdisciplinary diploma, Dipl.-Ing. Mechatronics, from the faculties of electrical and mechanical engineering, University of Karlsruhe.

Markus Heilig

Lageplan

Eingang
Nord-West
ICM
Eingang
Nord
Eingang
West
Atrium
Eingang
Nord-Ost
Eingang
Ost
Conference
Center Nord
Freigelände
C1
C2
C3
C4
C5
C6
B0
B1
B2
B3
B4
B5
B6
A1
A2
A3
A4
A5
A6

Weitere Veranstaltungen