Kalender
Datum & Uhrzeit
Suchen
Datum
{{range.dates[index].day}}
{{range.dates[index].date}}
Uhrzeit
Vormittags Mittags Nachmittags Abends
  • von
  • bis
  • Uhr
Thema
Veranstaltungsort
Veranstaltung
Eigenschaften
{{item.name}}
{{item.name}}
Messegelände

(bitte wählen Sie die gewünschten Bereiche)

Vortragssprache
Format

Veranstaltungskalender

Informationen zu Foren, Live-Demonstrationen, Accelerating Talents und Diskussionsrunden. In der Termindatenbank finden Sie auch das gesamte Forenprogramm.

Zurück zur Terminauswahl

Advanced Plasma Surface Activation for Hybrid Fusion Bonding

NOV
13
2019
13. NOV 2019

Presentation Halle ICM - Internationales Congress Center München SEMICON EUROPA > Advanced Packaging Conference > Session 5: Advanced Packaging

12:20-12:45 Uhr | ICM - Internationales Congress Center München ICM Room 13b, 1st Floor

Themen: SEMICON EUROPA

Chairman: Thomas Oppert (, PacTech - Packaging Technologies GmbH)

Format: Presentation

Sprache: Englisch

Wafer bonding can be considered as one of the key enabling technologies for future 3D devices in the microelectronic/photonic system industry. However, complementary metal-oxide-semiconductor (CMOS) structures present on those devices require dedicated and compatible low temperature (LT) bonding schemes such as hybrid bonding. In LT bonding research hybrid bonding has lately become more and more the focus of attention, due to distinct advantages especially within semiconductor processing.In this paper SUSS MicroTec introduces a novel highly flexible approach for atmospheric plasma surface activation that allows for versatile full wafer treatments and high bonding energies. The absence of directed ions and electrical fields in general translate in full CMOS compatibility of the new plasma concept, making it especially suited for hybrid bonding. The described surface activation approach can be optionally integrated in automated bond cluster platforms from SUSS MicroTec via an innovative tool integration concept also presented in this paper. The integration concept comes along with distinct advantages over vacuum plasma, such as increased throughput, higher cleanliness, lower tool footprint, reduced wafer handling, lower cost of ownership etc. as demonstrated in the scope of this publication.The highly flexible chemistry that can be used within the new plasma activation approach also enables metal-oxide removal, i.e. reduction of copper oxide surfaces present at wafer-to-wafer (W2W) and collective die-to-wafer (D2W) hybrid bonding applications for 3D integration schemes. In this work surface free energy (including polar and dispersive components), defectivity, bond-strength, surface hydration and the dependence of surface pre-treatment have been studied. Water contact angles (WCA) down to

Informationen

Thomas Schmidt
Thomas Schmidt
Product Manager

Lageplan

Eingang
Nord-West
ICM
Eingang
Nord
Eingang
West
Atrium
Eingang
Nord-Ost
Eingang
Ost
Conference
Center Nord
Freigelände
C1
C2
C3
C4
C5
C6
B0
B1
B2
B3
B4
B5
B6
A1
A2
A3
A4
A5
A6

Weitere Veranstaltungen