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Presentation Halle ICM - Internationales Congress Center München SEMICON EUROPA > Advanced Packaging Conference > Session 3: Test and Reliability II
17:45-18:10 Uhr | ICM - Internationales Congress Center München ICM Room 13b, 1st Floor
Themen: SEMICON EUROPA
Chairman: Klaus Pressel (, Infineon)
Increasingly WLCSP are used as solution for packaging, especially when the area needed for I/O matches the area needed for the function. Industry trend is to go thinner devices and smaller pitches. The mechanical integrity of WLCSP’s is stressed not only in the application, but also during board assembly at the customer.The breakthrough technology presented provides protection for both the top and bottom of the product, thus protecting the 8 corners of the device. Balancing the front and back side thickness of the compound enables reduction of the overall height while at the same time improve the BLR performance compared to more well-known 5 side protected WLCSP in the same package thickness.In 2018, I have presented the process flow and issues related to handling for 2 side molded WLCSP, using different molding materials and processes. I also indicated the board level reliability results for TMCL and drop test, however these were not completed at the time of the conference.In the meantime, we do have the results and the analysis of the results for sharing. The presentation will focus on the Surface Mounting process optimization as well as on the final TMCL and drop test results as function of minimum and typical solder quantity. The last part will be the outlook on this activity to bring this to an industrial standard for the selected materials.
NXP, Package Innovation
Tonny Kamphuis received his master in Mechanical Engineering at Twente University in 1986. The same year he joined Philips Semiconductors in the field of IC assembly equipment. He worked in Kaohsiung Taiwan from 1991 to 1992, after which he joined the discrete assembly equipment development department in Nijmegen. He has developed die bonders, wire bonders, molding machines as well as all type of handling equipment for both reel to reel and strip to strip based industrializations. Since the year 2000 he is focusing on assembly process development and industrialization for IC again. In 2007 NXP was founded, at NXP, he has filed several patents related and is focusing on package pathfinding.