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Holistic Approach to Improve the Reliability of Advanced Heterogeneous Packaging by Chemistry

NOV
12
2019
12. NOV 2019

Presentation Halle ICM - Internationales Congress Center München SEMICON EUROPA > Advanced Packaging Conference > Session 3: Test and Reliability II

17:20-17:45 Uhr | ICM - Internationales Congress Center München ICM Room 13b, 1st Floor

Themen: SEMICON EUROPA

Chairman: Klaus Pressel (, Infineon)

Format: Presentation

Sprache: Englisch

Heterogeneous integration involves the assembly of separately manufactured components and requires the combination of a broad variety of different materials with different characteristics. Redistribution layers (RDLs) consisting of Cu conductor lines and organic dielectric are key components of a variety of technologies to connect the various functional components. In particular, fan out wafer level packaging (FOWLP) with decreasing lines and spaces (L/S) was developed as an enhancement to standard WLP to allow for higher performance, decreased form factor, and significant cost reduction. Next generation FOWLP require decreasing the RDL pitch down to 1 µm or even below, which involves challenges in terms of reliability of the Cu conductor lines.With decreasing L/S, mechanical properties of RDL Cu lines become increasingly important. This is especially true with regard to the variety of materials, which are in direct contact upon heterogeneous integration of different components. In order to improve the reliability of such assembly, the mechanical properties of the individual materials need to be optimized. However, this improvement is limited by issues upon scaling down the Cu conductor lines. Thus, a different approach is required to provide sufficient reliability. In addition to optimization of the individual materials, a holistic approach would include the surrounding materials within the package. Recent findings emphasize the importance of the formation of a proper composite with the adjacent dielectric to improve the reliability of the Cu conductor lines. Utilization of the surrounding materials by composite formation constitutes a promising strategy to fulfill reliability criteria of upcoming FOWLP applications. Composites may benefit from synergistic effects and overcome limitations of the individual components. Different chemistry solutions will be discussed with respect to their impact on composite formation and suitability for potential 5G applications.

Informationen

Markus Hörburger

Markus Hörburger received his diploma degree of business chemistry at University of Ulm. He joined Atotech in 2014 as a Product Manager and is in charge of plating chemistries for Semiconductor Advanced Packaging, Leadframes and Connectors. In his function he is responsible for definition of R&D project’s, integration / introduction and marketing related activities for Advanced Packaging, such as ECD (Pillar / RDL) and electroless (ENEPIG) processes respectively Functional Electronics Coating, such as products for Leadframe and Connector industry. Before his actual position he worked at BASF as a Strategic Project Manager to bulit up an Innovation Network

Markus Hörburger
Product Manager SC & FEC

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