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Reliability Requirements of Advanced Packaging in the Era of Electrified, Automated and Connected Driving

NOV
12
2019
12. NOV 2019

Keynote Halle ICM - Internationales Congress Center München SEMICON EUROPA > Advanced Packaging Conference > Session 3: Test and Reliability II

16:00-16:30 Uhr | ICM - Internationales Congress Center München ICM Room 13b, 1st Floor

Themen: SEMICON EUROPA

Sprecher: PhD Przemyslaw Gromala (Robert Bosch GmbH, AE/ECU3)

Chairman: Klaus Pressel (, Infineon)

Format: Keynote

Sprache: Englisch

Development of automotive electronic systems is driven by three major trend: Electrification, Automation, and Connectivity. Each of these trends will bring specific reliability challenges:will revolutionize the entire powertrain and the required road infrastructure. Gradually but steadily, combustion engines will decrease their market share. Power electronics will be one of the key drivers of this development by remarkable innovations. New encapsulating materials will be introduced to meet these new requirements. In addition, sensors and control electronics will be added directly to the power stages for enhanced performance and safety. This increases the heterogeneity and complexity of these systems. will revolutionize transportation system. By 2025, conditionally and highly automated driving will reach SAE levels 3 and 4, respectively. By 2030, it will also be available in complex traffic situations, e.g., urban areas, and will reach SAE level 5. The highly automated vehicles will increase safety, provide greater comfort, and improve the traffic flows. New service modes seem to give a clear preference to car-sharing options over individual ownership. Consequently, the total operational time will significantly increase. will introduce consumer inspired technology components to harsh environments. Advanced integration and packaging schemes, such as system on chip (SoC) and system in package (SiP) based on smallest technologies nodes (e.g., 7 nm), will be introduced to automobiles with high reliability and fail-safe operation requirements.In my presentation I will try to answer what are the emerging reliability challenges for electronic packaging due to three major trends in automotive.

PhD Przemyslaw Gromala

Dr Przemyslaw Gromala is a simulation senior expert at Robert Bosch GmbH, Automotive Electronics in Reutlingen. Currently leading an international simulation team and FEM validation and verification lab with the focus on implementation of simulation driven design for electronic control modules and multi-chip power packaging for hybrid drives. His technical expertise includes material characterization and modeling, multi-domain and multi-scale simulation incl. fracture mechanics, V&V techniques, and prognostics and health management for safety related electronic smart systems.Prior joining Bosch Mr Gromala worked at Delphi development center in Krakow, as well as at Infineon research and development center in Dresden.He is an active committee member of the IEEE conferences: ECTC, EuroSimE, iTherm; ASME: InterPACK. Active committee member of EPoSS – defining R&D and innovation needs as well as policy requirements related to Smart Systems Integration and integrated Micro- and Nanosystems.He holds a PhD in mechanical engineering from Cracow University of Technology in Poland.

PhD Przemyslaw Gromala

Robert Bosch GmbH, AE/ECU3

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PhD Przemyslaw Gromala

Dr Przemyslaw Gromala is a simulation senior expert at Robert Bosch GmbH, Automotive Electronics in Reutlingen. Currently leading an international simulation team and FEM validation and verification lab with the focus on implementation of simulation driven design for electronic control modules and multi-chip power packaging for hybrid drives. His technical expertise includes material characterization and modeling, multi-domain and multi-scale simulation incl. fracture mechanics, V&V techniques, and prognostics and health management for safety related electronic smart systems.Prior joining Bosch Mr Gromala worked at Delphi development center in Krakow, as well as at Infineon research and development center in Dresden.He is an active committee member of the IEEE conferences: ECTC, EuroSimE, iTherm; ASME: InterPACK. Active committee member of EPoSS – defining R&D and innovation needs as well as policy requirements related to Smart Systems Integration and integrated Micro- and Nanosystems.He holds a PhD in mechanical engineering from Cracow University of Technology in Poland.

PhD Przemyslaw Gromala
Simulation senior expert

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