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Presentation Halle ICM - Internationales Congress Center München SEMICON EUROPA > Advanced Packaging Conference > Session 2: Test and Reliability I
14:30-14:55 Uhr | ICM - Internationales Congress Center München ICM Room 13b, 1st Floor
Themen: SEMICON EUROPA
Chairman: Peter Cockburn (, Cohu, Inc., ISG)
In today's production test environment, high power, high speed, high ball count, tight pitch and increased parallelism drive complexity into the ATE interface / probe card PCB. These factors inevitably drive PCB layer counts up, beyond what can be achieved in single lamination printed circuit boards, forcing more expensive and time consuming processes such as sequential lamination and HDI techniques.This presentation will discuss PCB fabrication constraints, technology extenders and introduces an alternative to standard PCB processing techniques. Power integrity, signal integrity, manufacturing throughput and reliability characteristics of available options will be compared. Specific examples to be discussed include: -Multitier PCB with 0.3mm DUT pitch in a 310mil thick PCB. -Memory test application with 100,000 pads and via interconnects in a 600mil thick PCB -WLCSP application with 0.35mm pitch in a 250 thick PCB
Harbor Electronics, Integration
Tom Bleakley is Vice President of Integration at Harbor Electronics where he oversees PCB design, assembly and test, applications and field service engineering. Tom’s team is responsible for ensuring that Harbor PCBA designs integrate well with fab, assembly and field support operations, optimizing probe card and load board PCBA performance as well as delivery times. Tom has spent his entire career in semiconductor test. Before Harbor with Everett Charles Technologies as a Product Manager. Before ECT, Tom served in Product Engineering and Test Technology roles with Intel’s Desktop Chipset group in Folsom, CA, and with Intel Communications group in Sacramento, CA. Tom began his career as a hardware design engineer with Micro Component Technology (MCT) in Shoreview, MN designing DC parametric and pin electronics hardware before moving to an Applications Engineering role. Tom holds a bachelor of science degree in electrical engineering (BSEE) from North Dakota State University.