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Semiconductors in a world where safety rules supreme

NOV
12
2019
12. NOV 2019

Keynote Halle ICM - Internationales Congress Center München SEMICON EUROPA > Advanced Packaging Conference > Session 2: Test and Reliability I

13:10-13:40 Uhr | ICM - Internationales Congress Center München ICM Room 13b, 1st Floor

Themen: SEMICON EUROPA

Sprecher: Michael Schuldenfrei (Optimal Plus, Business and Technology)

Chairman: Peter Cockburn (, Cohu, Inc., ISG)

Format: Keynote

Sprache: Englisch

Advanced packaging solutions incorporate multiple die into packages using a broad range of new techniques and technologies. These solutions have many benefits – lowering cost, reducing power consumption, increasing performance and more. However, they come with elevated risk – the more complex the solution, the more care we need to take to ensure we are delivering perfect parts. After all, in safety-critical applications like the autonomous and connected car, failures cannot be tolerated.In this presentation, we will present some of the quality and reliability challenges introduced by advanced packaging technologies and how Big Data Analytics can be leveraged to mitigate the risks.

Michael Schuldenfrei

Michael joined OptimalPlus in 2006, and brings over 30 years of software and information technology experience. Since joining the company he has served in several leadership roles including Chief Software Architect and CTO. Prior to that he served as Senior Software Architect at SAP, where he led a joint development project with Microsoft. He was also a Software Architect at Microsoft, where he led consulting engagements with the company’s major customers, and VP of R&D at ActionBase, heading up development of the company’s business management enterprise solutions.

Michael Schuldenfrei

Optimal Plus, Business and Technology

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Michael Schuldenfrei

Michael joined OptimalPlus in 2006, and brings over 30 years of software and information technology experience. Since joining the company he has served in several leadership roles including Chief Software Architect and CTO. Prior to that he served as Senior Software Architect at SAP, where he led a joint development project with Microsoft. He was also a Software Architect at Microsoft, where he led consulting engagements with the company’s major customers, and VP of R&D at ActionBase, heading up development of the company’s business management enterprise solutions.

Michael Schuldenfrei
Technology Fellow

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