Kalender
Datum & Uhrzeit
Suchen
Datum
{{range.dates[index].day}}
{{range.dates[index].date}}
Uhrzeit
Vormittags Mittags Nachmittags Abends
  • von
  • bis
  • Uhr
Thema
Veranstaltungsort
Veranstaltung
Eigenschaften
{{item.name}}
{{item.name}}
Messegelände

(bitte wählen Sie die gewünschten Bereiche)

Vortragssprache
Format

Veranstaltungskalender

Informationen zu Foren, Live-Demonstrationen, Accelerating Talents und Diskussionsrunden. In der Termindatenbank finden Sie auch das gesamte Forenprogramm.

Zurück zur Terminauswahl

5G enabler : Advanced Packaging

NOV
12
2019
12. NOV 2019

Keynote Halle ICM - Internationales Congress Center München SEMICON EUROPA > Advanced Packaging Conference > Session 1: Advanced Packaging Market Analytics

12:40-13:10 Uhr | ICM - Internationales Congress Center München ICM Room 13b, 1st Floor

Themen: SEMICON EUROPA

Sprecher: Emilie Jolivet (Yole Développement)

Chairman: Steffen Kroehnert (, ESPAT Consulting)

Format: Keynote

Sprache: Englisch

5G will totally redefine how the radio frequency (RF) front-end interacts in-between the network and the modem and the new RF bands, sub-6 GHz, and mm-wave pose big challenges for the industry. LTE evolution has led to complex architecture in today’s mobile phones, mostly due to carrier aggregation and RF’s board area and available antenna space have been reduced, leading to a densification trend with more handset OEMs adopting power amplifier modules and implementing new technics, i.e. antenna-sharing between LTE and WiFi. More densification in front-end modules will be required to enable new band integration and without tight integration 5G NR in the mmWave spectrum won’t be able to deliver the multi-gigabit speeds that is the key USP of 5G. Advanced multi die SiP packaging holds a large set of key technologies to address all flavors of 5G requirements that will enable its implementation in mobile.Advanced packaging represents an opportunity to increase end-product value offering advantages both in the scaling and functional roadmaps. Fan-Out platforms are increasingly viewed as one of the top options amongst leading package technologies. Fan-Out Packaging technology is not only a bridge to the CPI mismatch in pitch size but it is also a solution for functional performance and package dimension. Fan-Out packaging is essentially adopted in Radar for Automotive, APE for Smartphones and now potentially Antenna-in-Package for 5G mmWave smartphones and stacked memories-on-substrate for HPCs. Currently, all key players of different business models have Fan-Out packaging solutions in the market with a strong emphasis on cost and performance trade-off between Panel-level vs Wafer-level processing.

Emilie Jolivet

Emilie Jolivet is Director of the Semiconductor & Software Division at Yole Développement (Yole), part of Yole Group of Companies. Emilie manages the expansion of the technical and market expertise of her team. In addition, Emilie’s mission focusses on the management of business relationships with semiconductor leaders and the development of market research and strategy consulting activities. With its previous collaborations at Freescale and EV Group, Emilie developed a core expertise dedicated to package & assembly, semiconductor manufacturing, memory and software & computing.Emilie Jolivet holds a Master’s degree in Applied Physics specializing in Microelectronics from INSA (Toulouse, France) and graduated with an MBA from IAE (Lyon, France).

Emilie Jolivet

Yole Développement

Profil anzeigen

Informationen

Emilie Jolivet

Emilie Jolivet is Director of the Semiconductor & Software Division at Yole Développement (Yole), part of Yole Group of Companies. Emilie manages the expansion of the technical and market expertise of her team. In addition, Emilie’s mission focusses on the management of business relationships with semiconductor leaders and the development of market research and strategy consulting activities. With its previous collaborations at Freescale and EV Group, Emilie developed a core expertise dedicated to package & assembly, semiconductor manufacturing, memory and software & computing.Emilie Jolivet holds a Master’s degree in Applied Physics specializing in Microelectronics from INSA (Toulouse, France) and graduated with an MBA from IAE (Lyon, France).

Emilie Jolivet

Lageplan

Eingang
Nord-West
ICM
Eingang
Nord
Eingang
West
Atrium
Eingang
Nord-Ost
Eingang
Ost
Conference
Center Nord
Freigelände
C1
C2
C3
C4
C5
C6
B0
B1
B2
B3
B4
B5
B6
A1
A2
A3
A4
A5
A6

Weitere Veranstaltungen