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Packaging Trends for AI

NOV
12
2019
12. NOV 2019

Keynote Halle ICM - Internationales Congress Center München SEMICON EUROPA > Advanced Packaging Conference > Session 1: Advanced Packaging Market Analytics

12:10-12:40 Uhr | ICM - Internationales Congress Center München ICM Room 13b, 1st Floor

Themen: SEMICON EUROPA

Sprecher: Jan Vardaman (TechSearch International, Inc.)

Chairman: Steffen Kroehnert (, ESPAT Consulting)

Format: Keynote

Sprache: Englisch

Artificial Intelligence (AI) makes it possible for machines to learn from experience, adjust to new inputs and perform human-like tasks. AI or deep learning is expected to be applied to a wide range of applications, including connectivity or Internet of Things (IoT), big data processing and servers, cloud services, autonomous driving, 5G communications, smart factory or Industry 4.0, robotics, AR/VR. The package choice depends on many factors including design, density, reliability, and supply chain. This presentation examines the applications using AI and the packages in production today. The presentation also discusses future packages expected for these applications. Package choice, design, and materials impact and the importance of co-design will be discussed.

Jan Vardaman

E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided market research and technology trend analysis in semiconductor packaging since 1987. She is the co-author of How to Make IC Packages (by Nikkan Kogyo Shinbunsha), a columnist with Printed Circuit Design & Fab/Circuits Assembly, and the author of numerous publications on emerging trends in semiconductor packaging and assembly. She is a senior member of IEEE EPS and is an IEEE EPS Distinguished Lecturer. She is a member of SEMI, SMTA, IMAPS, and MEPTEC. She received the IMAPS GBC Partnership award in 2012 and the Daniel C. Hughes, Jr. Memorial Award in 2018. She is an IMAPS Fellow. Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium.

Jan Vardaman

TechSearch International, Inc.

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Jan Vardaman

E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided market research and technology trend analysis in semiconductor packaging since 1987. She is the co-author of How to Make IC Packages (by Nikkan Kogyo Shinbunsha), a columnist with Printed Circuit Design & Fab/Circuits Assembly, and the author of numerous publications on emerging trends in semiconductor packaging and assembly. She is a senior member of IEEE EPS and is an IEEE EPS Distinguished Lecturer. She is a member of SEMI, SMTA, IMAPS, and MEPTEC. She received the IMAPS GBC Partnership award in 2012 and the Daniel C. Hughes, Jr. Memorial Award in 2018. She is an IMAPS Fellow. Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium.

Jan Vardaman
President

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