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Vortrag PCB & EMS Speakers Corner
13:00-13:30 Uhr | PCB & EMS Speakers Corner, B3, booth 360
Themen: Mess- und Prüftechnik, QualitätssicherungSprecher: Dr. Markus Meier (Zestron ...a business division of Dr. O.K. Wack Chemie GmbH Sonderschau Cleaning & Contamination Testing Center)
Cracks, but also penetration weak spots in molds and pottings of electronic components and assembled circuit boards result in a drastic shortening of the service life or, in most cases, the immediate failure of the entire circuit. Particularly, in the case of ambient air with a high content of harmful gases or humidity, faulty spots in molds and pottings must be viewed very critically, as this enables direct access of the corrosive gases and humidity to the susceptible metal pieces of the components and circuits.
In order to test the reliability of electronic components and circuits and thus the tightness of the mentioned protective systems against corrosive gases and water vapour, harmful gas tests with different gases or gas mixtures such as sulphur dioxide, hydrogen sulphide, nitrogen oxides or chlorine are currently being carried out. In order to shorten the test time considerably and at the same time obtain a quick statement about the number and location of potential weak spots for gases and humidity, a quality test based on iodine vapour is proposed within the scope of this presentation.
Thus to the high reactivity and a high concentration of iodine vapour at 85 °C in the test chamber, an exposure time of 3 h can be sufficient to make visible even the smallest cracks and penetration weak spots in molds and pottings in the area of critical metallizations of components and circuits. Under these conditions, the iodine vapour can be generated with the assistance of an aqueous phase, which furthermore permits a simple and safe handling and test setup.
Zestron ...a business division of Dr. O.K. Wack Chemie GmbH Sonderschau Cleaning & Contamination Testing CenterProfil anzeigen