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Stencil Printing 008004/0201 Aperture Components

NOV
13
2019
13. NOV 2019

Vortrag PCB & EMS Speakers Corner

12:30-13:00 Uhr | PCB & EMS Speakers Corner, B3, booth 360

Themen: Löttechnik und Fügetechnik für Leiterplatten

Sprecher: Michael Butler, Edward Nauss

Format: Vortrag

Sprache: Englisch

This paper will focus on the application requirements of solder printing small aperture designs that concentrates on 008004 (inch) / 0201 (metric) size components and the results of a design of experiment printing these challenging apertures. As Moore’s law continues to be applied to component miniaturization, the next installment of reduced packaging has arrived in the form of the 008004/0201 for resistors and capacitors. With the component size roughly the size of a grain of sand, this presents specific challenges to solder printing process. To address these challenges, each aspect of the printing process will need be examined. This includes essential machine requirements including correct squeegee blades, tooling support and required calibrations to meet the demanding specifications. The correct match and design of materials will be addressed focusing on the stencil and substrate design along with solder paste and cleaning solvent requirements. A design of experiment will be reviewed that applies the machine and materials discussed that includes the printer and Solder Paste Inspection (SPI) setup and the specific machine parameters used. The results of these DOE’s will then be closely examined.

Sprecher

Michael Butler

Michael Butler

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Sprecher

Edward Nauss

Edward Nauss

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Informationen

Sprecher

Michael Butler
Michael Butler

Sprecher

Edward Nauss
Edward Nauss
ITW EAE

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