From Smart Shoes to a Cloud Connected Sports Ball - How Sensor Frameworks enable efficient development

Nov
16
2017

SEMICON forums > TechLOUNGE: Exhibitor Presentations

16. Nov 2017
10:15-10:30 h  |  Hall B1 TechLOUNGE / B1.168

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Subjects: 

SEMICON Europa

Participants: 

Shubhadip Paul 

(NXP Semiconductors, Sensors)

Type:
Exhibitor presentation
Company:
NXP Semiconductors, Sensors
Speech: English
The world today is more connected than it ever was. From watches to car infotainment, home alarms to blood pressure monitor, everything has become connected. Everywhere you look, you can find examples of products adding connectivity, sensor algorithms, and machine learning to unleash more information than ever before.
As an example, let’s explore the Smart Shoe and Connected Sports Ball. A shoe that was only providing a mechanism to cushion and support your foot is now being designed with the capability of connecting to your smartphone and giving your weight, measuring altitude changes, counting your steps and giving you compass direction. This is just the next generation shoes. A ball that was only to be kicked around and play is now being designed with the capability of connecting to the Cloud and providing motion and pressure data to your Smartphone or Desktop which can help you analyze your technique and help improve your skills.

In this presentation, I will provide concrete examples of a hardware and software ecosystem designed for battery powered applications requiring a low powered MCU, Bluetooth or Bluetooth Low Energy (BLE) and Cloud connectivity, along with sensor technologies such as Accelerometer, Magnetometer and a Pressure Sensor all powered by an Intelligent Sensor Software Development Kit (ISSDK).

Driven by the power of a Sensor Framework such as NXP’s ISSDK to read digital sensor data form multiple sensors and send them over BLE to a Smartphone or Desktop, multiple intelligent systems can be developed in minimal time with minimal effort. This platform can easily expand beyond a smart shoe or a ball by the consumer, medical and industrial markets allowing the next generation connected devices and sensor end nodes to achieve lower powered processing capability and aggregate sensor data.

Author
Shubhadip Paul Embedded Software Engineer, NXP Semiconductors, Sensors Show Profile

Location
Entrance North-West
C1
C2
C3
C4
Entrance North
B1
B2
B3
B4
B5
B6
A1
A2
A3
A4
A5
A6
ICM
B0
Entrance West
Entrance East
Nov
14
2017

SEMICON forums > TechARENA > Electronics for Automotive Session

Connected Vehicles – Part of the connected world and foundation of the 3d living space

14. Nov 2017
10:30-10:55 h  |  Hall B1 TechARENA1 / B1.1771
Chair: Stephan Raithel (DAS Europe)

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Nov
14
2017

SEMICON forums > TechLOUNGE: Exhibitor Presentations

Enabling Materials for Semiconductor and Sensor Assembly

14. Nov 2017
11:00-11:15 h  |  Hall B1 TechLOUNGE / B1.168

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Nov
14
2017

SEMICON forums > TechARENA > Advanced Materials Session 1: Advanced Techniques for Thin Film Processing of Next-Gen Nanoelectronics

All-printed thin-film transistors from networks of liquid-exfoliated nanosheets

14. Nov 2017
16:15-16:40 h  |  Hall B1 TechARENA1 / B1.1771
Chair: Hessel Sprey (ASM International, Corporate Research Development)

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Nov
15
2017

SEMICON forums > TechARENA > Market Briefing Session

Introduction

15. Nov 2017
10:00-10:05 h  |  Hall B1 TechARENA2 / B1.171
Chair: Christian Gregor Dieseldorff (SEMI, Industry Research & Statistics)

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Nov
16
2017

SEMICON forums > TechLOUNGE: Exhibitor Presentations

Solutions for thin and tiny dies with high die strength and for thinning WLCSP and eWLB wafers

16. Nov 2017
10:00-10:15 h  |  Hall B1 TechLOUNGE / B1.168

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Final report

That was productronica 2017

Full halls, constructive discussions and positive feedback. Experience the highlights of the 2017 exhibition all over again.

Final report

That was productronica 2017

Full halls, constructive discussions and positive feedback. Experience the highlights of the 2017 exhibition all over again.

That was productronica 2017

Full halls, constructive discussions and positive feedback. Experience the highlights of the 2017 exhibition all over again.

Exhibition sectors

The entire market showcases itself here

The only trade fair that depicts the entire value chain in electronics manufacturing.

Exhibition sectors

The entire market showcases itself here

The only trade fair that depicts the entire value chain in electronics manufacturing.

The entire market showcases itself here

The only trade fair that depicts the entire value chain in electronics manufacturing.

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