Enabling Materials for Semiconductor and Sensor Assembly

Nov
14
2017

SEMICON forums > TechLOUNGE: Exhibitor Presentations

14. Nov 2017
11:00-11:15 h  |  Hall B1 TechLOUNGE / B1.168

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Subjects: 

SEMICON Europa

Participants: 

Ruud de Wit 

(Henkel Electronic Materials NV, Semiconductor Assembly Materials)

Type:
Exhibitor presentation
Company:
Henkel Electronic Materials NV, Semiconductor Assembly Materials
Speech: English
Henkel's Electronic Materials division is globally active in developing and offering specialized adhesives, encapsulants, coatings, inks and soldering materials for automotive, industrial and consumer electronics applications AND semiconductor and sensor assembly.

Using its broad technology toolbox, the Henkel Semiconductor steering unit is successfully developing innovative solutions in liquid, film and B-stage format for :
- Advanced semiconductor packaging (like low warpage wafer level encapsulation and 3D interconnect)
- RF and Power device assembly (like high conductivity die attach, Insulating Metal Substrates and in-package EMI shielding)
- MEMS sensor assembly (like ultra-low and stable modulus

Author
Ruud de Wit EIMEA SU Head Semiconductors, Henkel Electronic Materials NV, Semiconductor Assembly Materials Show Profile

  • Participants

    Author
    Ruud de Wit EIMEA SU Head Semiconductors, Henkel Electronic Materials NV, Semiconductor Assembly Materials Show Profile

Location
Entrance North-West
C1
C2
C3
C4
Entrance North
B1
B2
B3
B4
B5
B6
A1
A2
A3
A4
A5
A6
ICM
B0
Entrance West
Entrance East
Nov
14
2017

SEMICON forums > TechARENA > Electronics for Automotive Session

Connected Vehicles – Part of the connected world and foundation of the 3d living space

14. Nov 2017
10:30-10:55 h  |  Hall B1 TechARENA1 / B1.1771
Chair: Stephan Raithel (DAS Europe)

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Nov
14
2017

SEMICON forums > TechARENA > Advanced Materials Session 1: Advanced Techniques for Thin Film Processing of Next-Gen Nanoelectronics

All-printed thin-film transistors from networks of liquid-exfoliated nanosheets

14. Nov 2017
16:15-16:40 h  |  Hall B1 TechARENA1 / B1.1771
Chair: Hessel Sprey (ASM International, Corporate Research Development)

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Nov
15
2017

SEMICON forums > TechARENA > Market Briefing Session

Introduction

15. Nov 2017
10:00-10:05 h  |  Hall B1 TechARENA2 / B1.171
Chair: Christian Gregor Dieseldorff (SEMI, Industry Research & Statistics)

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Nov
16
2017

SEMICON forums > TechLOUNGE: Exhibitor Presentations

Solutions for thin and tiny dies with high die strength and for thinning WLCSP and eWLB wafers

16. Nov 2017
10:00-10:15 h  |  Hall B1 TechLOUNGE / B1.168

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Nov
16
2017

SEMICON forums > TechLOUNGE: Exhibitor Presentations

High-Scandium Al-Sc Sputter Targets for MEMS Applications

16. Nov 2017
10:30-10:45 h  |  Hall B1 TechLOUNGE / B1.168

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Final report

That was productronica 2017

Full halls, constructive discussions and positive feedback. Experience the highlights of the 2017 exhibition all over again.

Final report

That was productronica 2017

Full halls, constructive discussions and positive feedback. Experience the highlights of the 2017 exhibition all over again.

That was productronica 2017

Full halls, constructive discussions and positive feedback. Experience the highlights of the 2017 exhibition all over again.

Exhibition sectors

The entire market showcases itself here

The only trade fair that depicts the entire value chain in electronics manufacturing.

Exhibition sectors

The entire market showcases itself here

The only trade fair that depicts the entire value chain in electronics manufacturing.

The entire market showcases itself here

The only trade fair that depicts the entire value chain in electronics manufacturing.

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