3DIC Assembly at Room Temperature Employing Binary Alloying

Nov
14
2017

SEMICON forums > TechLOUNGE: Exhibitor Presentations

14. Nov 2017
10:00-10:15 h  |  Hall B1 TechLOUNGE / B1.168

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Subjects: 

SEMICON Europa

Participants: 

Eric Schulte 

(SETNA LLC)

Type:
Exhibitor presentation
Company:
SETNA LLC
Speech: English
We present an alternative to Tin-based solder caps currently used for 3D-IC chip stacking. We propose a binary metallurgical system which can be bonded at room temperature to create robust mechanical and electrical interconnects. An Atmospheric Plasma process is used to de-oxidize and passivate the bond surfaces, followed by room temperature compression bonding. Subsequent chip layers can be stacked in the same manner at room temperature without requiring thermal excursions. This eliminates the bond process time normally consumed with melting and solidification, thus dramatically increasing bond throughput. Room temperature bonding also eliminates concerns about oxidation of exposed bonding surfaces over very long chip-to-wafer assembly cycles. Following completion and test of the stacked assembly, low-temperature solid-state annealing creates a binary alloy interconnect which is . An additional benefit of the Atmospheric Plasma pre-bond treatment is that all chip and bump surfaces are highly activated for very rapid post-bond capillary underfill.

Current Tin-based solders have been shown to produce a range of unstable intermetallic compounds with undesirable mechanical and electrical characteristics. The proposed Silver-Indium binary pair favors simple, post-bond low-temperature inter-diffusion of these two metals to form Ag2In, while thermodynamics exclude other nearby metals (i.e. Cu, Ni, etc.). Typical post-bond interdiffusion temperature of the binary metal pair is in the range of 80-120°C, and does not require compression during interdiffusion. Experimental results will be presented.

Author
Eric Schulte CTO, SETNA LLC Show Profile

Location
Entrance North-West
C1
C2
C3
C4
Entrance North
B1
B2
B3
B4
B5
B6
A1
A2
A3
A4
A5
A6
ICM
B0
Entrance West
Entrance East
Nov
14
2017

SEMICON forums > TechARENA > Electronics for Automotive Session

Connected Vehicles – Part of the connected world and foundation of the 3d living space

14. Nov 2017
10:30-10:55 h  |  Hall B1 TechARENA1 / B1.1771
Chair: Stephan Raithel (DAS Europe)

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Nov
14
2017

SEMICON forums > TechLOUNGE: Exhibitor Presentations

Enabling Materials for Semiconductor and Sensor Assembly

14. Nov 2017
11:00-11:15 h  |  Hall B1 TechLOUNGE / B1.168

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Nov
14
2017

SEMICON forums > TechARENA > Advanced Materials Session 1: Advanced Techniques for Thin Film Processing of Next-Gen Nanoelectronics

All-printed thin-film transistors from networks of liquid-exfoliated nanosheets

14. Nov 2017
16:15-16:40 h  |  Hall B1 TechARENA1 / B1.1771
Chair: Hessel Sprey (ASM International, Corporate Research Development)

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Nov
15
2017

SEMICON forums > TechARENA > Market Briefing Session

Introduction

15. Nov 2017
10:00-10:05 h  |  Hall B1 TechARENA2 / B1.171
Chair: Christian Gregor Dieseldorff (SEMI, Industry Research & Statistics)

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Nov
16
2017

SEMICON forums > TechLOUNGE: Exhibitor Presentations

Solutions for thin and tiny dies with high die strength and for thinning WLCSP and eWLB wafers

16. Nov 2017
10:00-10:15 h  |  Hall B1 TechLOUNGE / B1.168

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Final report

That was productronica 2017

Full halls, constructive discussions and positive feedback. Experience the highlights of the 2017 exhibition all over again.

Final report

That was productronica 2017

Full halls, constructive discussions and positive feedback. Experience the highlights of the 2017 exhibition all over again.

That was productronica 2017

Full halls, constructive discussions and positive feedback. Experience the highlights of the 2017 exhibition all over again.

Exhibition sectors

The entire market showcases itself here

The only trade fair that depicts the entire value chain in electronics manufacturing.

Exhibition sectors

The entire market showcases itself here

The only trade fair that depicts the entire value chain in electronics manufacturing.

The entire market showcases itself here

The only trade fair that depicts the entire value chain in electronics manufacturing.

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