NanoWiring und KlettWelding - Revolution in der Verbindungstechnologie

Nov
15
2017

SMT Speakers Corner

15. Nov 2017
11:00-11:30 h  |  Hall A1 / 220

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Subjects: 

Component mount technology, pick & place

Speaker: 

Dipl-Ing. Olav Birlem 

(NanoWired GmbH)

Type:
Lecture
Speech: German

With NanoWiring and KlettWelding, our company NanoWired GmbH launchs a disruptive 3D integration technique based on a nanotechnology that bonds for the first time different types of surfaces at room temperature and without using any additives by means of a two-step process, and thanks to the full-controlled coating of the surfaces to be assembled with nanowires. With NanoWiring and KlettWelding we bring electronic packaging industry one step beyond by overcoming current limitations on soldering or gluing techniques, which require high temperature >>120° and, often, noble or toxic metals, thus making the process economically viable for industrial production.
On the surfaces to be joined, nanorases are grown = NanoWiring. The lawn surfaces are pressed into each other at room temperature with normal bonding forces = KlettWelding and the metallic hair fuse and knot together to form a permanently solid, electrically and thermally conductive, metallic connection.
Revolutionizing your integration, I-4.0  -20 ° C ...> 400 ° C metallic connection made of copper
Create space for your performance  Stack of chips opens up third dimension
Extend your life cycle  process at room temperature conserves components
Increase your precision  No REFLOW process more necessary, no swimming
Expand your flexibility  Any surfaces and materials, also aluminum
Protect our environment  No lead, selenium or antimony
By providing the electronics packaging industry (in particular the SC and e-mobility sectors) with the products (consumables), processes (software, SW), and equipment required for the implementation of the NanoWiring and KlettWelding, technology in their current production lines, we will facilitate the uptake of nanotechnology by this industry, thus enabling the next generation of consumer electronics, sensors, accumulators, and batteries among others.

Speaker
Dipl-Ing. Olav Birlem, NanoWired GmbH

Location
Entrance North-West
C1
C2
C3
C4
Entrance North
B1
B2
B3
B4
B5
B6
A1
A2
A3
A4
A5
A6
ICM
B0
Entrance West
Entrance East
Nov
16
2017

SMT Speakers Corner

Process Control and Highest Quality beyond Optical and X-Ray Inspection

16. Nov 2017
09:30-10:00 h  |  Hall A1 / 220
Speaker: Hagen Berger (Viscom AG)

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Nov
17
2017

SMT Speakers Corner

Cleaning of Silicones and other conformal coatings

17. Nov 2017
09:30-10:00 h  |  Hall A1 / 220
Speaker: Lenka Musilova (DCT Czech S.R.O.)

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Nov
15
2017

SMT Speakers Corner

Business Outlook for Global Electronic & EMS/ODM Industries

15. Nov 2017
15:30-16:00 h  |  Hall A1 / 220
Speaker: Walt Custer (Custer Consulting Group)

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Nov
14
2017

SMT Speakers Corner

Business Outlook for Global Electronic & EMS/ODM Industries

14. Nov 2017
15:30-16:30 h  |  Hall A1 / 220
Speaker: Walt Custer (Custer Consulting Group)

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Nov
16
2017

productronica SMT Speakers Corner

IPC Hand Soldering Competition - Price ceremony

16. Nov 2017
17:30-18:00 h  |  Hall A1 / 220

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Final report

That was productronica 2017

Full halls, constructive discussions and positive feedback. Experience the highlights of the 2017 exhibition all over again.

Final report

That was productronica 2017

Full halls, constructive discussions and positive feedback. Experience the highlights of the 2017 exhibition all over again.

That was productronica 2017

Full halls, constructive discussions and positive feedback. Experience the highlights of the 2017 exhibition all over again.

Exhibition sectors

The entire market showcases itself here

The only trade fair that depicts the entire value chain in electronics manufacturing.

Exhibition sectors

The entire market showcases itself here

The only trade fair that depicts the entire value chain in electronics manufacturing.

The entire market showcases itself here

The only trade fair that depicts the entire value chain in electronics manufacturing.

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