Nordson MARCH Will be Ready to Discuss Plasma Technologies at Productronica 2017

10.11.2017 |
November 10, 2017
NORDSON BV |
Plasma technologies for printed circuit board, microelectronics, and semiconductor packaging

Concord, California, USA - 01 November 2017 - Nordson MARCH, a Nordson company (NASDAQ:NDSN), a global leader in plasma processing technology, will be ready to discuss plasma technologies for printed circuit board, microelectronics, and semiconductor packaging in stand A2.345/445 at Productronica, the world's leading trade fair for electronics development and production, to be held in Munich, Germany, November 14-17, 2017.

Nordson MARCH's VIA systems for the plasma treatment of printed circuit boards are the benchmark for panel and roll-to-roll processing. The SPHERE systems for wafer processing are designed to handle all wafer sizes up to 450mm including 300mm wafers on wafer frames, making Nordson MARCH the natural partner for plasma systems for wafer level packaging.


For more information, contact Nordson MARCH at info@nordsonmarch.com
Bergerstraat 8 6226 BD Maastricht Netherlands Phone: +31 43 3524466 Fax: 3637722 E-Mail Website Hall A2 Booth 345
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That was productronica 2017

Full halls, constructive discussions and positive feedback. Experience the highlights of the 2017 exhibition all over again.

That was productronica 2017

Full halls, constructive discussions and positive feedback. Experience the highlights of the 2017 exhibition all over again.

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The only trade fair that depicts the entire value chain in electronics manufacturing.

The entire market showcases itself here

The only trade fair that depicts the entire value chain in electronics manufacturing.

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